According to the latest leaks, AMD is planning to integrate “3D cores” into its upcoming Zen 7 processors. This new technology is expected to significantly boost gaming performance.
Insider Moore’s Law Is Dead (MLID) reports that AMD is considering multiple core types for its new architecture, including:
- Traditional cores,
- Dense and high-performance cores,
- Energy-efficient cores,
- Experimental 3D cores.
The primary distinction of 3D cores from existing solutions like 3D V-Cache lies in their architecture. While Ryzen 7 9800X3D uses a single 64MB cache chiplet for the entire CCD (Core Complex Die) with eight cores, Zen 7 will feature individual cache chiplets for each 3D core.
This could deliver substantial performance improvements in gaming, reducing latency and increasing memory bandwidth. Exact specifications of the new architecture remain undisclosed, but if the leaks prove accurate, Zen 7 may become the most powerful gaming processor on the market.
AMD is likely to use the latest manufacturing processes from TSMC or Samsung, which should further enhance energy efficiency and performance.
